AI Infrastructure Public

Broadcom

Networking and custom silicon for AI data centers

Founded 1961 Palo Alto, CA 37,000+ employees AVGO Hardware + Software licensing
AVGO
$406.54 ▲ +0%
Market Cap Tier
mega-cap

Price delayed up to 15 minutes. Source: Yahoo Finance.

Earnings Snapshot

Q1 FY2026: Revenue $14.9B (+25% YoY). AI revenue $4.1B (+65%). VMware integration driving software margins.

About Broadcom

Broadcom is a semiconductor and infrastructure software company whose networking chips and custom AI accelerators are critical infrastructure for AI data centers. Under CEO Hock Tan, Broadcom has grown through a series of major acquisitions — including CA Technologies, Symantec's enterprise division, and VMware ($69B in 2023) — to become one of the largest technology companies by revenue.

In AI, Broadcom plays two essential roles. First, its networking silicon (Tomahawk, Jericho switches) provides the high-bandwidth interconnects that link thousands of GPUs in AI training clusters. No large-scale AI training run happens without Broadcom networking chips. Second, Broadcom designs custom AI accelerators (XPUs) for hyperscale customers — most notably Google's TPU, which uses Broadcom-designed silicon.

Broadcom's AI revenue has grown rapidly as hyperscalers invest in custom silicon. The company projects AI-related revenue will exceed $10 billion, driven by custom accelerator design wins and the insatiable demand for faster networking in AI data centers.

Technology & Approach

Broadcom's technology spans two critical layers of AI infrastructure. In networking, Tomahawk and Jericho switching silicon provides the bandwidth to connect GPU clusters at 400G and 800G speeds — essential for distributed AI training where thousands of GPUs must communicate constantly. In custom compute, Broadcom's ASIC design services enable hyperscalers to build purpose-built AI accelerators optimized for their specific workloads, offering better performance-per-watt than general-purpose GPUs for inference at scale.

Products & Services

Tomahawk 5

Industry-leading Ethernet switch chip with 51.2 Tbps bandwidth. Powers the network fabric connecting GPU clusters in AI data centers.

Networking

Jericho3-AI

Fabric chip designed specifically for AI data center networks, supporting 800G connectivity between GPU nodes.

Networking

Custom AI Accelerators

ASIC design services for hyperscale customers. Designed Google's TPU silicon and custom chips for other major cloud providers.

Custom Silicon

VMware

Enterprise virtualization and cloud infrastructure platform. Acquired for $69B in 2023.

Software

Leadership

H
Hock Tan
President & CEO
Led Broadcom's transformation through $100B+ in acquisitions.
C
Charlie Kawwas
President, Semiconductor Solutions
Oversees chip design and manufacturing.

Notable Achievements

  • Networking silicon is in virtually every major AI data center globally
  • Designed custom silicon for Google's TPU program
  • $69B VMware acquisition was the largest tech deal of 2023
  • AI-related revenue projected to exceed $10B
  • Tomahawk switches are the industry standard for high-bandwidth AI networking

Competitive Landscape

Companies competing in the same space as Broadcom.

Financial Disclosure: NexChron provides financial data for informational purposes only. This is not investment advice, a recommendation to buy or sell securities, or an offer to transact. Stock prices are delayed up to 15 minutes and sourced from Yahoo Finance. Funding round data is compiled from public reports and may not reflect the most current information. Company valuations, revenue estimates, and financial projections are based on publicly available data and may be inaccurate or outdated. Always consult a qualified financial advisor before making investment decisions. NexChron, its founder, and contributors may hold positions in companies mentioned on this site.